Information for Industry Participants, Sponsors, and Exhibitors
The International High Speed Intelligent Communication (HSIC) is an important field of theory, design, and implementation of millimeter wave integrated circuits and systems, sensor network, optical communications and MIMO/OFDM systems. The theme of the HSIC2012 is “Technologies for Next Generation Wireless Communications” to promote more high speed chip designs and the development of intelligent circuits/systems techniques to enhance the smart system command and control capability and to display the highly intelligent communication performances. The HSIC2012 will offer a rich program of high quality with distinguished invited speakers from all over the world and provide a broad forum of exchanges for researchers and scholars.
The HSIC2012 welcomes Technical & Academic Exhibitors to participate in this conference. Participation as a sponsor/exhibitor is offered at four principal levels.
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Platinum Sponsor |
$10,000 |
Plenary presentation, company logo displayed on print material and CD, hotlink from conference website, one standard exhibition booth, 3 registrations included |
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Gold Sponsor |
$5,000 |
Reception or banquet address, company logo displayed on print material and CD, hotlink from conference website, one standard exhibition booth, 2 registrations included |
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Silver Sponsor |
$2,000 |
Company logo displayed on print and CD, hotlink from conference website, one standard exhibition booth, 1 registration included |
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Exhibitor |
$1,200 |
One standard exhibition booth, 1 registration included |
Note：
‐ Additional standard exhibition booth each USD300
‐ Additional person to be registered (limited to two) USD300
Event (banquet, reception, lunch) and other forms of sponsoring will also be possible.
For inquiries please contact Xiaowei Zhu at xwzhu@seu.edu.cn |
